JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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MATSUTA 旺興達有限公司

The film-forming substance in the raw material, i. Preparation and use of the same method as in Example 1.

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid.

The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin.


The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.

A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: The flux according to claim 1, wherein: A flux according to claim 1, wherein: A soldering flux as claimed in claim 5, characterized in that: CN CNA en CN CNA en.

RM-5 (Flux for BGA / CSP Solder Ball)

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CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

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